Esec Innovation In Silicium Verpackungen - Switzerland

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Company name
Esec Innovation In Silicium Verpackungen
Location
Hinterbergstrasse 32 6330cham, Switzerland
Contact number
Fax
0417495177
Website address
Company description
Besi and its product groups Datacon, Esec, Fico and Meco are supplier of die sorting, flip chip and multi chip die bonding, packaging and plating equipment for the semiconductor industry.
Listed in categories
General Business
Wire bonder
Advanced packaging
Die bonder
Flip chip
Die sorter
Plating
Packaging
Led
Epoxy
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